Electronic Adhesives Selection Guide

Parlite UV curable Adhesives are used for various Electronics Adhesives Selection Guide Devices and applications, assemblies. It extends solutions for Potting and encapsulation for electronic parts.

4710

Grade4710
SubstratesMetals, Plastics, Ferrite
Viscosity @ 25 °C17,000 cps
Shore Hardness45D
Elongation90%
CureUV, Visible or Heat
Tensile1,000 psi
ApplicationHigh viscosity encapsulant for precision application to specific electronic assembly areas, glob top application.

 

 

4019

Grade4019
SubstratesMetals, Plastics, Ferrite
Viscosity @ 25 °C600 cps
Shore Hardness55D
Elongation72%
CureUV, Visible or Heat
Tensile750 psi
ApplicationSpecifically designed for potting. Bonds with light adhesion: for connectors, thermal switches, temper proofing.

4025

Grade4025
SubstratesMetals, Ceramic, Glass Filled epoxy
Viscosity @ 25 °C150 cps
Shore Hardness85D
Elongation12%
CureUV, Visible and Heat
TensileClear
ApplicationTough, glossy conformal coating with excellent adhesion to wide variety of boards and masks. Fast cure.