Electronic Adhesives Selection Guide
Parlite UV curable Adhesives are used for various Electronics Adhesives Selection Guide Devices and applications, assemblies. It extends solutions for Potting and encapsulation for electronic parts.
4710
| Grade | 4710 |
| Substrates | Metals, Plastics, Ferrite |
| Viscosity @ 25 °C | 17,000 cps |
| Shore Hardness | 45D |
| Elongation | 90% |
| Cure | UV, Visible or Heat |
| Tensile | 1,000 psi |
| Application | High viscosity encapsulant for precision application to specific electronic assembly areas, glob top application. |
4019
| Grade | 4019 |
| Substrates | Metals, Plastics, Ferrite |
| Viscosity @ 25 °C | 600 cps |
| Shore Hardness | 55D |
| Elongation | 72% |
| Cure | UV, Visible or Heat |
| Tensile | 750 psi |
| Application | Specifically designed for potting. Bonds with light adhesion: for connectors, thermal switches, temper proofing. |
4025
| Grade | 4025 |
| Substrates | Metals, Ceramic, Glass Filled epoxy |
| Viscosity @ 25 °C | 150 cps |
| Shore Hardness | 85D |
| Elongation | 12% |
| Cure | UV, Visible and Heat |
| Tensile | Clear |
| Application | Tough, glossy conformal coating with excellent adhesion to wide variety of boards and masks. Fast cure. |